login
Clemens Valens @ elektormagazine.com shows us a new IC Package that keeps the IC cool.
Texas Instruments’ HotRod QFN is a thermally enhanced plastic package with solder lands on all sides as well as power buses for enhanced current carrying capability. Inside the package the die is mounted on a copper lead frame which eliminates the power wire bonds, improving electrical and thermal performance. This technique also improves application efficiency and minimizes package parasitic radiation.
Hot rods keep the die cool – [Link]
Please follow and like us:
RELATED POSTS
24 April, 2017 Fast Single-Pixel Camera
11 April, 2020 20A/40V Integrated Power Module for DC Brushless Motors (BLDC)
28 April, 2017 Master Your Arduino Skills With Arduino Playground Book
26 March, 2020 Small, affordable gyroscope for navigating without GPS
31 January, 2022 Alliance Memory 4GB and 8GB eMMC solutions
21 August, 2019 Rigol MSO8000 2GHz 4-Channel Digital Oscilloscope Series
Subscribe
Login
0 Comments
