Search Results for : 5G use cases

Unveiling the breakthrough release, ASRock Industrial launches the NUC Ultra 100 BOX/ NUCS Ultra 100 BOX Series powered by the highly anticipated Intel® Core™ Ultra processors (Meteor Lake-H). Featuring 3D performance hybrid architecture supporting up to 14 cores and 20 threads...

ASRock Industrial releases state-of-the-art 4X4 BOX 8040 Series Mini PCs and 4X4 8040 Motherboard Series, powered by AMD Ryzen™ 8040 Series APUs, crafted to elevate trusted performance and AI PC capabilities. Featuring up to 8 “Zen 4” cores/ 16 threads and AMD Radeon™...

Powered by AMD® Ryzen™ Embedded V3000, the module features up to 8 cores at 15W, 45W, integrated 2x10G Ethernet, with extreme temperature options for various networking use cases Summary: ADLINK brings 8 cores at 15W, 45W TDP in its latest COM Express Basic size Type 7...

Featuring 1 x16 PCIe Gen5 and up to 16 Performance-cores plus 8 Efficient-cores, the module is ideal for compute-intensive use cases such as test & measurement, medical imaging, and industrial AI Summary: The ADLINK COM-HPC-cRLS Client type Size C module based on 13th Gen...

Quectel Wireless Solutions has launched its 5G RedCap (Reduced Capability) modules, the Rx255C series. The company has designed these modules to improve wireless performance and low-latency communication. Along with its integrated 5G connectivity, the modules offer significant...

Taoglas’ new transparent flex antennas offer a clear alternative to opaque antennas for covert cellular, Wi-Fi, and GNSS connectivity in innovative IoT applications. The future of antennas is clear Taoglas®, a trusted provider of antennas and IoT components that helps solve complex...

ASRock Industrial announces the 4X4 BOX 7000/D5 Series Mini PCs powered by AMD Ryzen™ 7000U-Series APUs up to 8 Zen 3+ cores. Featuring maximum dual DDR5 4800MHz memory up to 64GB, the 4X4 BOX 7000/D5 Series enhances performance by unleashing higher standards of power, speed, and...

ADLINK Technology Inc., a global leader in edge computing, introduces two new Computer-on-Modules based on the latest Intel® Core™ processors, available in two form factors — COM Express (COM.0 R3.1) Type 6 Module based on Intel® 13th Gen Core™ mobile processors and...