Taoglas Invisible Antenna Unlocks IoT Innovations with Covert Connectivity
IoTRF

Taoglas Invisible Antenna Unlocks IoT Innovations with Covert Connectivity

Taoglas’ new transparent flex antennas offer a clear alternative to opaque antennas for covert cellular, Wi-Fi, and GNSS connectivity in innovative IoT applications. The future of antennas is clear Taoglas®, a trusted provider of antennas and IoT components that helps solve complex...

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ASRock Industrial Launches 4X4 BOX 7000/D5 Series with AMD Ryzen™ 7000U-Series APUs to Unleash Power and Speed
SBC

ASRock Industrial Launches 4X4 BOX 7000/D5 Series with AMD Ryzen™ 7000U-Series APUs to Unleash Power and Speed

ASRock Industrial announces the 4X4 BOX 7000/D5 Series Mini PCs powered by AMD Ryzen™ 7000U-Series APUs up to 8 Zen 3+ cores. Featuring maximum dual DDR5 4800MHz memory up to 64GB, the 4X4 BOX 7000/D5 Series enhances performance by unleashing higher standards of power, speed, and...

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ADLINK releases COM Express and COM-HPC modules based on Intel 13th Gen Core processors – delivering up to 24 cores
SBC

ADLINK releases COM Express and COM-HPC modules based on Intel 13th Gen Core processors – delivering up to 24 cores

ADLINK Technology Inc., a global leader in edge computing, introduces two new Computer-on-Modules based on the latest Intel® Core™ processors, available in two form factors — COM Express (COM.0 R3.1) Type 6 Module based on Intel® 13th Gen Core™ mobile processors and...

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ODROID H3 and H3+ Boards Come with Intel Jasper Lake Quad-Core Processors
SBC

ODROID H3 and H3+ Boards Come with Intel Jasper Lake Quad-Core Processors

Last year, when Hardkernel decided to discontinue the production of the ODROID-H2+ SBC as a result of the global chip shortage currently faced by the IoT market, we thought that was the end for that line of boards, little did we know that the company had a lot up their sleeves. We are...

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Enhancing MCUs and ROS Robots with the MetaSense RGBD ToF 3D Cameras
SensorTop Stories

Enhancing MCUs and ROS Robots with the MetaSense RGBD ToF 3D Cameras

The Sipeed announced the MetaSense RGBD ToF family of 3D Cameras for microcontrollers and ROS-operated Robots, which is currently in development. The MetaSense 3D cameras use the Time-of-Flight (ToF) principle for providing 3-dimensional information. ToF utilizes light and measures the...

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VIA SOM-9X35 Starter Kit for Edge AI IoT
IoTSBC

VIA SOM-9X35 Starter Kit for Edge AI IoT

The VIA SOM-9X35 is a low-power quad-core MediaTek i350 based processor board, ideal for IoT solutions and edge AI use cases, like facial recognition, object identification, motion tracking, OCR, and bio-metric measurement. To further accelerate product development time, a VIA SOM-9X35...

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floLIVE introduces a new iSIM providing regulatory-compliant global connectivity for connecting IoT devices at scale
IoT

floLIVE introduces a new iSIM providing regulatory-compliant global connectivity for connecting IoT devices at scale

floLIVE, a leading IoT connectivity provider of advanced 5G network solutions and a full suite of cloud-based global connectivity services, today announced it has collaborated with Kigen - a global leader in eSIM and iSIM security, and Sony Semiconductor Israel (Sony) - a leading...

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ADLINK releases its first SMARC module based on Qualcomm QRB5165
SBC

ADLINK releases its first SMARC module based on Qualcomm QRB5165

ADLINK releases its first SMARC module based on Qualcomm QRB5165 enabling high-performance robots and drones at low power Integrated IoT technologies provide on-device AI capabilities at the edge. ADLINK Technology Inc., a global leader in edge computing, released the LEC-RB5 SMARC...

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