Tag: SIP

The newly developed System-in-Package (SIP) is a significant advancement for power-efficient cellular projects. It features a 64MHz Arm Cortex-M33 processor, LTE-M/NB-IoT cellular connectivity, and DECT NR+ connectivity, all integrated into a single chip. What sets this SIP apart is its...

We have yet another Feather form factor board that is released by SparkFun in association with CircuitDojo, which is powered by the famous Nordic nRF9160 microcontroller, SparkFun Thing Plus- nRF9160, designed for users working in smart cities and smart agriculture applications. Last...

IoTeX has launched a campaign on crowdsupply for Pebble Tracker, which is a secure, battery-operated, cellular-IoT prototyping platform designed for blockchain-based applications. Pebble Tracker is based on Nordic Semiconductor’s latest low-power nRF9160 System-in-Package (SiP), and...

Octavo Systems OSD32MP15x System In Package Releases into Production with Higher Performance and Two New Development Platforms Octavo Systems, an ST Authorized Partner, has expanded its support of the OSD32MP15x System in Package, the smallest available STMicroelectronics STM32MP1...

Ultra small, super low power u-blox M8 GNSS SiP module. ZOE-M8B is u-blox’s ultra small, highly integrated GNSS SiP (System in Package), measuring just 4.5 x 4.5 x 1.0 mm. Making use of the Super-Efficient (Super-E) mode, ZOE-M8B offers an ideal balance between miniature size, low...

The OSD335x C-SiP System-in-Package (SiP) developed by Octavo, is a concept package that is modeled on its previous Sitara AM335x based SiP by including up to 16GB eMMC, an oscillator along with 1GB DDR3, PMIC, LDO, and EEPROM. The OSD335x C-SiP, is the most consolidated System-In-Package...

The ESP32-PICO-D4 is a new variant of the known ESP32 SoC released by Espressif Systems. The PICO variant module measures around 13x19mm and it is designed as a system-in-package unlike the SoC styled ESP32, and comes with an ESP32 dual-core processor, a 4MB SPI flash, a crystal...

Octavo Systems back in 2017 released their OSD335x-SM System-In-Package device, a powerful ARM Cortex®-A8 SIP-based package. The OSD335x-SM was a device of its class, measured at just 21mm x 21mm, and the OSD335x-SM is the smallest AM335x processor-based module on the market today that...